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Cross border and multi-country projects - Low-Power Processors and Semiconductor Chips

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Copyright: Slovene government

The objective of the multi-country project on Low-Power Processors and Semiconductor Chips is to strengthen the capabilities in design and increase the resilience of EU and Slovenian semiconductor value chains, connect national and EU processes, and strengthen the microelectronics value chain. This will be done through (1) a modular approach (tools and equipment, materials, design, manufacturing, packaging and testing), driven by the needs of the industry, (2) the definition of a microelectronics ecosystem, (3) integrating the whole microelectronics ecosystem in Europe.

The Ministry of Economic Development and Technology launched a call for corporate interest for the project of Microelectronics in April 2021. The covered areas are communication chip design, development of advanced semiconductor processes, system integration and cores for the use in different smart mobility applications, smart cities and communities and smart factories. Six companies expressed their interest.

The Ministry of Economy, Tourism and Sport published a call for project proposals in March 2023, with the deadline for applications 15 May 2024.

RRF support amounts to EUR 1.5 million.

More information on the investment can be found on the following links: