CONPARF at Beyond Semiconductor - Cross border and multi-country projects - Low-Power Processors and Semiconductor Chips

The project focuses on the research and development of semiconductor-compatible radio frequency (RF) filters that enable implementation together with digital logic (e.g. processors) on a single chip and in advanced semiconductor CMOS technologies with the goals of:

• Demonstrating the feasibility of a programmable radio frequency filter structure in semiconductor (CMOS) technology as an alternative to radio frequency filters made of piezoelectric materials, which replace the current state of the technology
• Evaluating filter performance in the simulation environment and on the manufactured chip.
• Evaluating the possibilities of integration with digital logic in the form of a general-purpose processor with safety functions. The project aims to address the change in the traditional technological approach and introduce new concepts in three directions:
  • User perspective: Contribute to a leap in radio frequency signal processing technology (LTE, 5G, 6G, etc.) that will enable implementation in semiconductor CMOS technologies with the potential for greater integration, lower cost, greater efficiency and greater flexibility of communication chips, both in in the form of a final product as a service.
  • Technological perspective: To bring digital chips closer to antennas by transferring analog signal filtering based on piezoelectric materials to semiconductor CMOS technology with integrated digital data processing and enabling significantly more programmable software defined radio (SDR) concepts.
  • Integration and cyber perspective: Provide components resistant to cyber threats and investigate the impact of complex digital logic (e.g. a processor with security functions) on developed sensitive analog circuits, whose characteristics can be significantly degraded due to integration.

The IPCEI ME/CT project brings together 68 projects from 14 EU Member States, involving large companies, SMEs and research institutions. European co-financing enables the development of innovations that will be key to the future of European microelectronics and contribute to a sustainable future.

The Recovery and Resilience Facility provides funding of EUR 750,000, while the total value of the investment is EUR 1.4 million. The project started in June 2022 and will be finalised by June 2026.